Role Overview
We are seeking a Lead High-Speed Digital Design Engineer to drive the technical execution of our next-generation hardware platforms. In this role, you will take ownership of the full product lifecycle—from schematic architecture and power/reset analysis to SI/PI simulation, layout guidance, and lab bring-up. You will guide layout resources, establish design workflows, and act as the core technical interface for engineering teams and clients.
Key Responsibilities
Hardware Design & Architecture
- Design multi-layer PCBs around high-performance ARM-based Multicore SoCs, RFSOC/FPGA and complex PMIC architectures.
- Implement high-speed interfaces: LPDDR4/5, PCIe Gen 4, USB 3.2/4.0, Camera & Display interfaces and 1G/10G/100G Ethernet.
- Integrate wireless systems: Wi-Fi 6E/7 and Bluetooth (BT) with RF front-end co-existence routing.
Analysis & Simulation
- Model Power-On Reset (PoR) topologies, rail ramp rates, and low-power state transitions.
- Perform comprehensive PDN analysis to optimize plane shapes, target impedance profiles, and multi-rail DC IR drops.
- Execute detailed Decoupling analysis to determine optimal bulk and ceramic capacitor counts, values, sizing, and cavity placement.
- Run SI/PI simulations using any of Ansys HFSS/SIwave, Cadence Sigrity, or Keysight ADS to mitigate crosstalk, reflection, and jitter.
Layout Oversight & Material Trade-offs
- Select ultra-low-loss materials (e.g., Megtron, Isola, Rogers, FR4 ) and define advanced PCB stack-ups.
- Enforce HDI rules for stacked/staggered microvias, trace width geometries, and capacitor mounting pad/via loops.
- Set layout constraints for memory topologies, 1G/10G/100G Ethernet differential targets, and RF via shielding.
Compliance, EMI/EMC & Thermal Engineering
- Design for EMI/EMC mitigation from day one, minimizing radiated/conducted emissions and ensuring high immunity.
- Own compliance testing for regulatory certifications including FCC, CE etc.. at external test labs.
- Validate thermal stability by evaluating board-level power dissipation, checking component junction temperatures, and collaborating on heatsink/thermal interface material (TIM) placement.
Debug, Lab Bring-up , Performance testing & Documentation
- Hardware Bring up, Isolate hardware faults using oscilloscopes, VNAs, and logic analyzers.
- Coordinate board reworks and execute root-cause analysis (RCA) on prototype failures.
- Author technical specs, layout constraint logs, bring-up guides, and hardware errata trackers.
- Performance testing and characterization of interfaces /peripherals
Project Leadership & Client Interaction
- Lead and guide layout and simulation engineers to ensure strict design compliance.
- Establish design workflows, hardware checklists, and rigorous peer review gates.
- Scope customer requirements, translate use cases into engineering specs, and present technical trade-offs.
Required Technical Skills
- Experience: 4 to 8 years of proven experience in high-speed digital board design and architecture.
- Processor Expertise: Practical experience with high-performance ARM-based Multicore SoC architectures.
- EDA Tools: High proficiency in Cadence Allegro, Altium Designer, or Mentor Graphics Xpedition.
- Regulatory Knowledge: Hands-on experience with EMI/EMC chamber troubleshooting and FCC/CE certification requirements.
- Education: Bachelor’s or Master’s degree in Electrical, Electronics, or Computer Engineering.